- Heat Spreader for Trenz Electronic MPSoC-Module TE0813-02(KK0813-02)* Exkl. MwSt. exkl. Versandkosten
- High-Performance Xilinx Zynq Z-7045-Modul, 1 GByte DDR3, 8,5 x 8,5 cm* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC Modules TE0807 from REV02* Exkl. MwSt. exkl. Versandkosten
- UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+ (TEBF0808-05)* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z015-1CLG485I, 1 GByte DDR3L, 4 x 5 cm* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC-Module TE0807-04 (KK0807-04)* Exkl. MwSt. exkl. Versandkosten
- SoM with AMD Zynq™ 7045-2I incl. Heat Spreader(TE0745-03-92I31-AK)* Exkl. MwSt. exkl. Versandkosten
The micromodules designed by Trenz Electronic feature modern Xilinx FPGAs. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC. |