- Carrier Board for Trenz Electronic TEM0005 Microsemi SmartFusion2 SoC* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC-Module TE0807-04 (KK0807-04)* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC Modules TE0807 from REV02* Exkl. MwSt. exkl. Versandkosten
- High-Performance Xilinx Zynq Z-7045-Modul, 1 GByte DDR3, 8,5 x 8,5 cm* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic MPSoC Module TE0817-02 (KK0817-02)* Exkl. MwSt. exkl. Versandkosten
- CYC1000 with Cyclone 10 FPGA, 8 MB SDRAM, 8 MB Flash, 6.15 x 2.5 cm* Exkl. MwSt. exkl. Versandkosten
The micromodules designed by Trenz Electronic feature modern Xilinx FPGAs. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC. |