- SoM with AMD Zynq™ 7030-1I incl. Heat Spreader(TE0745-03-71I31-AK)* Exkl. MwSt. exkl. Versandkosten
- Heat spreader with fan for Trenz Electronic modules TE0865 (KK0865-02)* Exkl. MwSt. exkl. Versandkosten
- Carrier Board for Trenz Electronic TEM0005 Microsemi SmartFusion2 SoC* Exkl. MwSt. exkl. Versandkosten
- Heat Spreader for Trenz Electronic Modules TE0714 from REV04(KK0714-04)* Exkl. MwSt. exkl. Versandkosten
- CYC1000 with Cyclone 10 FPGA, 8 MB SDRAM, 8 MB Flash, 6.15 x 2.5 cm* Exkl. MwSt. exkl. Versandkosten
- SoM with AMD Zynq™ 7045-3E incl. Heat Spreader(TE0745-03-93E31-AK)* Exkl. MwSt. exkl. Versandkosten
- Testboard for the Trenz Electronic MPSoC module TE0865 (TEBT0865-01)* Exkl. MwSt. exkl. Versandkosten
- UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+ (TEBF0808-05)* Exkl. MwSt. exkl. Versandkosten
- SoC Module with Xilinx Zynq XC7Z020-1CLG400I, 1 GByte DDR3L, 4 x 6 cm* Exkl. MwSt. exkl. Versandkosten
- DataStorm DAQ - M-Board FMC Carrier for M-Series Precision Converters* Exkl. MwSt. exkl. Versandkosten
The micromodules designed by Trenz Electronic feature modern Xilinx FPGAs. With small size and high-density connectors, they can be used nearly everywhere. Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC. |