Customers frequently viewed
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 6.08 *
* Excl. VAT
excl.
Shipping
RUT241 - 4G router (North America) + SDK + One free RMS credit, Cellular network region: North america
EUR 146.26 *
* Excl. VAT
excl.
Shipping
Trenz Electronic GmbH
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827001460
Manufacturer Product Number: ATS-X50170P-C1-R0
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 31.74
*
Content
1 piece
Log in and get better prices. Or contact us and request B2B status.
* Excl. VAT excl. Shipping
Item ID | 101238 |
Condition | New |
Legacy item ID | 3432 |
Model | ATS-X50170P-C1-R0 |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 800 g |
Net weight | 800 g |
Customs tariff number | 84718090 |
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 6.08 *
* Excl. VAT
excl.
Shipping
RUT241 - 4G router (North America) + SDK + One free RMS credit, Cellular network region: North america
EUR 146.26 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 6.08 *
* Excl. VAT
excl.
Shipping
RUT241 - 4G router (North America) + SDK + One free RMS credit, Cellular network region: North america
EUR 146.26 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 6.08 *
* Excl. VAT
excl.
Shipping
Solderless Breadboard Kit with Two Power Rails - academic(340-038 )
EUR 6.08 *
* Excl. VAT
excl.
Shipping
FPGA Module with AMD Spartan™ 6 LX75-3I, 128 MB DDR3L, Mini-USB 2.0, 4 x 5 cm(TE0630-03-63I12-A)
EUR 266.80 *
* Excl. VAT
excl.
Shipping
MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1E, 2 GByte DDR4, 5.2 x 7.6 cm
EUR 336.22 *
* Excl. VAT
excl.
Shipping
Special offer