Trenz Electronic GmbH
BGA Heat Sink for Trenz Electronic Module TEI0009, 29 x 29 x 12.5 mm (ATS-X53290G-C1-R0)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827003055
Manufacturer Product Number: ATS-X53290G-C1-R0
Taric/custom code:
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 29.70
*
Content
1 piece
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* Excl. VAT excl. Shipping
The BGA Heat Sink is a 29 x 29 x 12.5 mm standard heat sink with thermal tape. It is made of aluminium with blue anodized finish.
Features
- Series: maxiFLOW, superGRIP™
- Type: Top Mount
- Material: Aluminium
- Material Finish: Blue Anodized
- Attachment Method: Clip, Thermal Material
- External dimensions: 29 x 29 x 12.5 mm
- Thermal resistance at forced air flow: 13.10°C/W @ 200 LFM
Scope of Delivery
- 1 x Heat sink for Trenz Electronic modules from TEI0009 series
Additional Information
- Manufacturer: QATS, Advanced Thermal Solutions, Inc.
- Manufacturer's article number: ATS-X53290G-C1-R0
- RoHS-6 conform: yes
- REACH compliant: yes
- Support Forum
The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.
| Item ID | 102603 |
| Condition | New |
| Legacy item ID | 3885 |
| Model | ATS-X53290G-C1-R0 |
| Manufacturer | Trenz Electronic GmbH |
| Manufacturing country | Germany |
| Content | 1 piece |
| Weight | 800 g |
| Net weight | 800 g |
| Customs tariff number |
