Trenz Electronic GmbH

MPSoC Module with AMD Zynq UltraScale+ ZU7CG-1I, 4 GByte DDR4, 5.2 x 7.6 cm (TE0817-02-7AI81-A)

AMD Zynq UltraScale+ XCZU7CG-1FBVB900I, 4 GByte DDR4, 128 MByte QSPI Boot Flash, 5.2 cm x 7.6 cm form factor


Código de artículo VAR-827003084

Número de pieza del fabricante: TE0817-02-7AI81-A

Código aduanero:


Disponible para envío inmediato: 0

Tiempo de tramitación: 3 días. Para pedidos con un valor neto total inferior a 70 euros, cobraremos unos gastos de tramitación de 15 euros.

Artículo ubicado en y enviado desde: Riedlingen, Alemania


1.913,19 EUR *
Contenido 1

* Sin IVA excl. Gastos de envío


This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The predecessor of this article is TE0817-01-7AI21-A. All changes are in the Product Change Notification (PCN).

The TE0817 is largely identical in construction to the TE0807. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.

The Trenz Electronic TE0817-02-7AI81-A is a powerful MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU7CG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq™ UltraScale+™ XCZU7CG-1FBVB900I
    • Speedgrade: -1
    • Temperature range: Industrial
    • Package: FBVB900I
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte QSPI Boot Flash
    • EEPROM with MAC address
  • On Board
    • Oscillator
  • Interface
    • 4 x B2B Connector (ADM6)
      • up to 204 PL IO
        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4 GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • Power supply via B2B Connector needed.

  • Dimension
    • 5.2 cm x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

Development Support

A carrier board and a test board are in development for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0817-02-7AI81-A Trenz Electronic MPSoC module with AMD Zynq™ UltraScale+™ ZU7CG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Identificación de artículo 102632
Estado
ID de artículo histórico 3882
Modelo TE0817-02-7AI81-A
Fabricante Trenz Electronic GmbH
País de origen
Contenido 1 undefined
Peso 800 g
Peso neto 800 g