Trenz Electronic GmbH

MPSoC Module with AMD Zynq UltraScale+ ZU4EG-1I, 4 GByte DDR4, 5.2 x 7.6 cm (TE0803-04-4BI21-A)

AMD/Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784I, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm


Référence de l’article: VAR-827003052

Numéro de produit du fabricant: TE0803-04-4BI21-A

Code douane:


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Article situé / expédié de : Riedlingen, Allemagne


554,42 EUR *
Contenu 1 pièce

* Hors TVA hors Frais de livraison


This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

 

The predecessor of this article is TE0803-03-4BI21-A. All changes are in the Product Change Notification (PCN).

Note: Product modification for modules with a serial number greater than 732326. Product Change Notification (PCN).

This module will not be discontinued, but we recommend the TE0813 module series with an improved connector for new projects.

The Trenz Electronic TE0803-04-4BI21-A is an industrial-grade MPSoC module integrating a AMD/Xilinx Zynq UltraScale+ with ZU4EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784I
  • ZU4EG, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 4 GByte (64-bit) width DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • 2 Kbit Serial EEPROM for MAC Address
  • 48 High-density (HD) I/O's (2 banks)
  • Graphic Processing Unit (GPU)
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: 4 x PS-GTR, 4 x PL-GTH
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0803-04-4BI21-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq UltraScale+ ZU4EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

ID de l’art. 102600
État
ID de l'ancien article 3870
Modèle TE0803-04-4BI21-A
Fabricant Trenz Electronic GmbH
Pays de fabrication Allemagne
Contenu 1 pièce
Poids 800 g
Poids net 800 g